Invention Grant
- Patent Title: Apparatus and method for obtaining slice-support information
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Application No.: US16869963Application Date: 2020-05-08
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Publication No.: US11638205B2Publication Date: 2023-04-25
- Inventor: Qing Wei , Ömer Bulakci , Henrik Olofsson
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Guangdong
- Agency: Womble Bond Dickinson (US) LLP
- Main IPC: H04W48/18
- IPC: H04W48/18 ; H04W76/11 ; H04W8/08 ; H04W48/16

Abstract:
Embodiment of the invention describe an apparatus for an access node, which is configured to receive slice-support information; and/or receive slice-context information and determine slice-support information based on the slice-context information; wherein the slice-support information comprises a mapping of a slice to an area, in particular a tracking area or a slice-support area; and process a slice-related information based on the slice-support information.
Public/Granted literature
- US20200267639A1 APPARATUS AND METHOD FOR OBTAINING SLICE-SUPPORT INFORMATION Public/Granted day:2020-08-20
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