Invention Grant
- Patent Title: Methods and apparatus for cleaning substrates
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Application No.: US17378096Application Date: 2021-07-16
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Publication No.: US11638937B2Publication Date: 2023-05-02
- Inventor: Hui Wang , Xi Wang , Fuping Chen , Fufa Chen , Jian Wang , Xiaoyan Zhang , Yinuo Jin , Zhaowei Jia , Jun Wang , Xuejun Li
- Applicant: ACM Research (Shanghai) Inc.
- Applicant Address: CN Shanghai
- Assignee: ACM Research (Shanghai) Inc.
- Current Assignee: ACM Research (Shanghai) Inc.
- Current Assignee Address: CN Shanghai
- Agency: K&L Gates LLP
- Main IPC: B08B3/12
- IPC: B08B3/12 ; B06B1/02 ; B06B1/06 ; H01L21/02 ; H01L21/67
Abstract:
A method for effectively cleaning vias (20034), trenches (20036) or recessed areas on a substrate (20010) using an ultra/mega sonic device (1003, 3003, 16062, 17072), comprising: applying liquid (1032) into a space between a substrate (20010) and an ultra/mega sonic device (1003, 3003, 16062, 17072); setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside vias (20034), trenches (20036) or recessed areas on the substrate (20010) increasing to a first set value, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device (1003, 3003, 16062, 17072); after the ratio of total bubbles volume to volume inside the vias (20034), trenches (20036) or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate (20010) being cleaned.
Public/Granted literature
- US20220032344A1 METHODS AND APPARATUS FOR CLEANING SUBSTRATES Public/Granted day:2022-02-03
Information query
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