Invention Grant
- Patent Title: In situ process chamber chuck cleaning by cleaning substrate
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Application No.: US16682814Application Date: 2019-11-13
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Publication No.: US11638938B2Publication Date: 2023-05-02
- Inventor: Mor Azaria , Giampietro Bieli , Shai Mark , Adi Pahima , Yoram Uziel
- Applicant: KLA Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA Corporation
- Current Assignee: KLA Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Suiter Swantz pc llo
- Main IPC: B08B6/00
- IPC: B08B6/00 ; H01L21/687 ; B08B3/08
Abstract:
A cleaning assembly is disclosed. The cleaning assembly includes a substrate. One or more patterns are formed on a bottom side of the substrate. One or more structures within the one or more patterns attract one or more particles from a chuck via at least one of electrostatic attraction or mechanical trapping when the substrate is positioned on the chuck.
Information query
IPC分类:
