A method of debonding a first layer from a second layer, wherein the first layer is bonded to the second layer by an adhesive located between the first and second layers. The method includes inserting a blade of a cleaving tool between the first and second layers, and exerting a controlled force on the cleaving tool to move the cleaving tool so as to de-bond the first and second layers in a region. The force exerted is controlled to match a de-bonding force calculated for the region, and such that the movement of the cleaving tool stops when the calculated force is less than a force required to move the cleaving tool, and continues when the calculated force is higher than or equal to the force required to move the cleaving tool.