Invention Grant
- Patent Title: Modified bismaleimide resin, method for preparing the same, prepreg, copper clad laminate and printed circuit board
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Application No.: US17004206Application Date: 2020-08-27
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Publication No.: US11639420B2Publication Date: 2023-05-02
- Inventor: Te-Chao Liao , Hao-Sheng Chen , Hung-Yi Chang , Chi-Lin Chen
- Applicant: NAN YA PLASTICS CORPORATION
- Applicant Address: TW Taipei
- Assignee: NAN YA PLASTICS CORPORATION
- Current Assignee: NAN YA PLASTICS CORPORATION
- Current Assignee Address: TW Taipei
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: TW108138990 20191029
- Main IPC: C08G73/12
- IPC: C08G73/12 ; C08J5/24 ; B32B15/20
Abstract:
A modified bismaleimide resin, a method for preparing the same, a prepreg, a copper clad laminate, and a printed circuit board are provided. The modified bismaleimide resin is formed by reacting a diamine having a specific structure with maleic anhydride, and has greater amounts of non-polar and hydrophobic groups in the molecular structure thereof.
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