Invention Grant
- Patent Title: Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same
-
Application No.: US17479259Application Date: 2021-09-20
-
Publication No.: US11639438B2Publication Date: 2023-05-02
- Inventor: Yong Yeop Park , Dong Hwan Lee , Kyoung Chui Bae , Min Joon Seo , Chui Ho Lee
- Applicant: SAMSUNG SDI CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG SDI CO., LTD.
- Current Assignee: SAMSUNG SDI CO., LTD.
- Current Assignee Address: KR Yongin-si
- Agency: Lee IP Law, P.C.
- Priority: KR10-2020-0148137 20201106
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08G59/22 ; C08K3/22 ; C08G59/68 ; C08G59/42 ; C08G59/12 ; C08G59/62
Abstract:
An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the epoxy resin composition, the epoxy resin composition including an epoxy resin; a curing agent; an inorganic filler; and a curing catalyst, the epoxy resin including an epoxy resin represented by Formula 1:
Public/Granted literature
Information query
