Invention Grant
- Patent Title: Massively-parallel micronozzle array for direct write electrodeposition of high-density microstructure arrays
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Application No.: US15857362Application Date: 2017-12-28
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Publication No.: US11639556B2Publication Date: 2023-05-02
- Inventor: Joe Walczyk , Pooya Tadayon , Andrew Hoitink , Tanner Schulz
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Essential Patents Group, LLP.
- Main IPC: C25D17/00
- IPC: C25D17/00 ; C25D5/02 ; H05K13/00 ; H05K3/18 ; C25D1/00
Abstract:
A micronozzle assembly, comprising a reservoir, an array of structures comprising micronozzles, a porous structure positioned between the reservoir and the array, and an electrode within the reservoir, wherein the electrode comprises any of a mesh, a frame along the perimeter of the cavity of the reservoir, or a rod extending into a cavity of the reservoir.
Public/Granted literature
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