Invention Grant
- Patent Title: Radiative cooling device having multilayer structure
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Application No.: US17110479Application Date: 2020-12-03
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Publication No.: US11639832B2Publication Date: 2023-05-02
- Inventor: Heon Lee , Soomin Son , Dongwoo Chae
- Applicant: Korea University Research and Business Foundation
- Applicant Address: KR Seoul
- Assignee: Korea University Research and Business Foundation
- Current Assignee: Korea University Research and Business Foundation
- Current Assignee Address: KR Seoul
- Agency: NSIP Law
- Priority: KR10-2020-0100751 20200811
- Main IPC: B32B3/00
- IPC: B32B3/00 ; F28F21/06 ; B32B9/00 ; B32B9/04 ; B32B15/08 ; B32B27/06

Abstract:
The present disclosure relates to a technical idea of reducing the surface temperature of a material or temperature under a material by emitting heat under a device to the outside by absorbing and emitting long-wavelength infrared light corresponding to the wavelength range of the atmospheric window while minimizing absorption of light of the solar spectrum. More particularly, the present disclosure relates to a technology for providing a radiative cooling device having a multilayer structure that is capable of increasing sunlight reflection through differences in the refractive indexes of the device-forming materials while performing selective emission over the wavelength range of the atmospheric window using a radiative cooling device having a multilayer structure composed of polymers and inorganic materials.
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