Invention Grant
- Patent Title: Dual-pattern optical 3D dimensioning
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Application No.: US16585847Application Date: 2019-09-27
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Publication No.: US11639846B2Publication Date: 2023-05-02
- Inventor: Tao Xian , Chen Feng , Paul Poloniewicz , Scott Bracken
- Applicant: Honeywell International Inc.
- Applicant Address: US NJ Morris Plains
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morris Plains
- Agency: Alston & Bird LLP
- Main IPC: G06V10/24
- IPC: G06V10/24 ; G06T7/521 ; G06V10/145 ; G06V10/147

Abstract:
An optical dimensioning system includes one or more light emitting assemblies configured to project one or more predetermined patterns on an object; an imaging assembly configured to sense light scattered and/or reflected off the object, and to capture an image of the object while the patterns are projected; and a processing assembly configured to analyze the image of the object to determine one or more dimension parameters of the object. The light emitting assembly may include a single piece optical component configured for producing a first pattern and second pattern. The patterns may be distinguishable based on directional filtering, feature detection, feature shift detection, or the like. A method for optical dimensioning includes illuminating an object with at least two detectable patterns; and calculating dimensions of the object by analyzing pattern separate of the elements comprising the projected patterns. One or more pattern generators may produce the patterns.
Public/Granted literature
- US20210097321A1 DUAL-PATTERN OPTICAL 3D DIMENSIONING Public/Granted day:2021-04-01
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