Invention Grant
- Patent Title: Integrated circuit testing apparatus and method
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Application No.: US17467580Application Date: 2021-09-07
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Publication No.: US11639956B2Publication Date: 2023-05-02
- Inventor: Mark Zhang , Arvin Guo , Jeff Tamasi , Steve Liu
- Applicant: UI Green Micro & Nano Technologies Co Ltd
- Applicant Address: CH Suzhou
- Assignee: UI Green Micro & Nano Technologies Co Ltd
- Current Assignee: UI Green Micro & Nano Technologies Co Ltd
- Current Assignee Address: CH Suzhou
- Agency: Avek IP, LLC
- Agent Blake E. Vande Garde
- Main IPC: G01R31/28
- IPC: G01R31/28

Abstract:
A test socket comprising a guide plate with a lower surface engaged with an upper surface of a main test structure, the guide plate further including an upper surface which is parallel to the lower surface and an opening extending through the guide plate, the main test structure includes a body with one or more apertures through the upper surface and one or more probes mounted within the main test structure, the probes including a front end which extends through the apertures for engagement by a lead or terminal pad of a device to be tested, and a tail end which is secured within the main test structure by an elastomeric material.
Public/Granted literature
- US20210396802A1 INTEGRATED CIRCUIT TESTING APPARATUS AND METHOD Public/Granted day:2021-12-23
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