- Patent Title: Photosensitive resin composition and cured film comprising the same
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Application No.: US16467702Application Date: 2018-07-24
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Publication No.: US11640111B2Publication Date: 2023-05-02
- Inventor: Min Hyung Lee , Dai Seung Choi
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Agency: Rothwell, Figg, Ernst & Manback, P.C.
- Priority: KR10-2017-0118859 20170915,KR10-2018-0085443 20180723
- International Application: PCT/KR2018/008367 WO 20180724
- International Announcement: WO2019/054625 WO 20190321
- Main IPC: G03F7/037
- IPC: G03F7/037 ; C08G73/10 ; C08L79/08 ; C08G73/22 ; C09D179/08
Abstract:
A photosensitive resin composition including a poly(imide-benzoxazine) block copolymer, and a cured film. The poly(imide-benzoxazine) block copolymer included in the photosensitive resin composition enables the formation of a cured film having excellent mechanical and insulation even at a low temperature of less than 200° C.
Public/Granted literature
- US20200004149A1 PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM COMPRISING THE SAME Public/Granted day:2020-01-02
Information query
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