Invention Grant
- Patent Title: Actinic ray-sensitive or radiation-sensitive resin composition, pattern forming method, and method of manufacturing electronic device
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Application No.: US16368522Application Date: 2019-03-28
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Publication No.: US11640113B2Publication Date: 2023-05-02
- Inventor: Hideaki Tsubaki , Hajime Furutani , Akihiro Kaneko , Wataru Nihashi , Shuji Hirano
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2016-191775 20160929
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/38 ; G03F7/038 ; C08F220/18 ; G03F7/16 ; G03F7/20 ; G03F7/32 ; H01L21/027

Abstract:
Provided is an actinic ray-sensitive or radiation-sensitive resin composition including: (A) a resin including a repeating unit (a) represented by Formula (1); (B) a compound that generates an acid by irradiation with actinic rays or radiation; and (C) an organic solvent. A concentration of solid contents of the actinic ray-sensitive or radiation-sensitive resin composition is 4 mass % or less. (in the formula, R11 and R12 each independently represent a hydrogen atom, a halogen atom, or a monovalent organic group. R13 represents a hydrogen atom, a halogen atom, or a monovalent organic group or is a single bond or an alkylene group, and is bonded to L or Ar in the formula to form a ring. L represents a single bond or a divalent linking group. Ar represents an aromatic ring group. n represents an integer of 2 or more.)
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