Invention Grant
- Patent Title: Pattern-enhanced spatial correlation of test structures to die level responses
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Application No.: US17395632Application Date: 2021-08-06
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Publication No.: US11640160B2Publication Date: 2023-05-02
- Inventor: Richard Burch , Qing Zhu
- Applicant: PDF Solutions, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: PDF Solutions, Inc.
- Current Assignee: PDF Solutions, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Dergosits & Noah LLP
- Main IPC: G05B19/418
- IPC: G05B19/418
Abstract:
Enhancement of less dominant patterns for parametric wafer measurements. Dominant patterns are removed from the parametric pattern thereby revealing a less dominant pattern. The less dominant patterns can be used to identify root causes for yield loss that are not visible in the original parametric measurements.
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