Invention Grant
- Patent Title: RFID security tape
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Application No.: US17256552Application Date: 2018-06-28
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Publication No.: US11640513B2Publication Date: 2023-05-02
- Inventor: Chee Kean Lim , Kia Boon Chew , Xiaojing Wu , Huangwei Huang
- Applicant: Ascent Solutions Pte Ltd
- Applicant Address: SG Singapore
- Assignee: Ascent Solutions Pte Ltd
- Current Assignee: Ascent Solutions Pte Ltd
- Current Assignee Address: SG Singapore
- International Application: PCT/SG2018/050317 WO 20180628
- International Announcement: WO2020/005153 WO 20200102
- Main IPC: G06K19/077
- IPC: G06K19/077

Abstract:
An RFID security tape having: a layer of tamper-evident tape; a layer of an RFID inlay; a blocking layer; a layer of metal foil having an adhesive bottom surface; and a layer of a release liner, wherein all layers of the RFID security tape are in adhesive connection with each other and wherein the layer of the RFID inlay is configured to be damaged when the RFID security tape has been applied to an asset and the layer of tamper-evident tape is subsequently removed from the asset.
Public/Granted literature
- US20210182644A1 RFID SECURITY TAPE Public/Granted day:2021-06-17
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