Invention Grant
- Patent Title: Signature panel for ID documents and payment cards
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Application No.: US17238089Application Date: 2021-04-22
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Publication No.: US11640607B2Publication Date: 2023-05-02
- Inventor: Daoshen Bi , Robert L. Jones , William M. O'Connor , Yecheng Wu
- Applicant: Idemia Identity & Security USA LLC
- Applicant Address: US MA Billerica
- Assignee: Idemia Identity & Security USA LLC
- Current Assignee: Idemia Identity & Security USA LLC
- Current Assignee Address: US MA Billerica
- Agency: Nixon & Vanderhye, PC
- Main IPC: G06Q20/40
- IPC: G06Q20/40 ; G06Q20/34 ; G06K19/02

Abstract:
An identification document includes a card structure including a plastic material, a surface of the card structure including a first surface region that includes a plurality of depressions formed in the surface according to a predefined pattern; and a second surface region that includes a majority of a surface area of the identification document, wherein the second surface region is non-porous. A surface energy of the surface in the first surface region is greater than a surface energy of the surface in the second surface region.
Public/Granted literature
- US20210334803A1 Signature Panel for ID Documents and Payment Cards Public/Granted day:2021-10-28
Information query