Invention Grant
- Patent Title: Multilayer coil component
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Application No.: US16806892Application Date: 2020-03-02
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Publication No.: US11640867B2Publication Date: 2023-05-02
- Inventor: Atsuo Hirukawa
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JPJP2019-038543 20190304
- Main IPC: H01F17/00
- IPC: H01F17/00 ; H01F27/29 ; H01F27/32 ; H01F41/04

Abstract:
A multilayer coil component includes a multilayer body that is formed by stacking a plurality of insulating layers on top of one another and that has a coil built into the inside thereof; and a first outer electrode and a second outer electrode that are electrically connected to the coil. The coil is formed by electrically connecting a plurality of coil conductors, which are stacked together with insulating layers, to one another. A first main surface of the multilayer body is a mounting surface. A stacking direction of the multilayer body and an axial direction of the coil are parallel to the mounting surface. The coil includes a plurality of different coil conductors having different coil diameters, and shortest distances from the first main surface to the coil conductors are identical for all of the plurality of different coil conductors.
Public/Granted literature
- US20200286664A1 MULTILAYER COIL COMPONENT Public/Granted day:2020-09-10
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |