Invention Grant
- Patent Title: Coil component
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Application No.: US16281810Application Date: 2019-02-21
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Publication No.: US11640870B2Publication Date: 2023-05-02
- Inventor: Ju Hwan Yang , Byung Soo Kang , Byeong Cheol Moon
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0110409 20180914
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/29 ; H01F41/04 ; H01F41/12 ; H01F27/32

Abstract:
A coil component includes a body having one surface and the other surface opposing each other in a first direction; an internal insulating layer buried in the body; a coil portion disposed in the internal insulating layer, and forming at least one turn centering on an axis in a second direction perpendicular to the first direction; first and second external electrodes disposed on one surface of the body and spaced apart from each other, and connected to the coil portion; an external insulating layer covering the body and exposing the first and second external electrodes. Lengths of the first and second external electrodes taken in the second direction are shorter than a length of the external insulating layer taken in the second direction.
Public/Granted literature
- US20200090853A1 COIL COMPONENT Public/Granted day:2020-03-19
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