Invention Grant
- Patent Title: Electronic component and board having the same
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Application No.: US17307411Application Date: 2021-05-04
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Publication No.: US11640877B2Publication Date: 2023-05-02
- Inventor: Heung Kil Park , Gu Won Ji , Sang Soo Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2020-0140955 20201028
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/248 ; H05K1/18 ; H01G4/012

Abstract:
An electronic component includes: a multilayer capacitor including a capacitor body and first and second external electrodes respectively disposed on opposing end surfaces of the capacitor body; and an ESD member disposed on a first side surface of the multilayer capacitor perpendicular to a mounting surface of the multilayer capacitor, such that the ESD of the multilayer capacitor may be effectively controlled.
Public/Granted literature
- US20220130613A1 ELECTRONIC COMPONENT AND BOARD HAVING THE SAME Public/Granted day:2022-04-28
Information query