Invention Grant
- Patent Title: Winding capacitor package structure and method of manufacturing the same
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Application No.: US17022286Application Date: 2020-09-16
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Publication No.: US11640878B2Publication Date: 2023-05-02
- Inventor: Chieh Lin , Chung-Jui Su
- Applicant: APAQ TECHNOLOGY CO., LTD.
- Applicant Address: TW Miaoli County
- Assignee: APAQ TECHNOLOGY CO., LTD.
- Current Assignee: APAQ TECHNOLOGY CO., LTD.
- Current Assignee Address: TW Miaoli County
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: TW109119390 20200610
- Main IPC: H01G4/32
- IPC: H01G4/32 ; H01G4/005 ; H01G4/224

Abstract:
A winding capacitor package structure and a method of manufactured the same are provided. The winding capacitor package structure includes a winding assembly, a package assembly, a conductive assembly, and a bottom carrier frame. The winding assembly includes a winding positive foil and a winding negative foil. The winding assembly is enclosed by the package assembly. The package assembly includes a casing structure and a filling body received inside the casing structure. The casing structure includes a main casing for enclosing the filling body and a retaining body inwardly bent from a bottom side of the main casing. The filling body includes a plurality of layered structures, and each of the layered structure is connected between the winding assembly and the casing structure. Therefore, the filling body including the layered structures can be retained and limited inside the casing structure through the retaining body.
Public/Granted literature
- US20210391118A1 WINDING CAPACITOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-12-16
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