Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US17443345Application Date: 2021-07-26
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Publication No.: US11640916B2Publication Date: 2023-05-02
- Inventor: Takahiro Yamaguchi , Jun Sawashima , Akihisa Ensatsu
- Applicant: SCREEN Holdings Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee: SCREEN Holdings Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Ostrolenk Faber LLP
- Priority: JPJP2020-145033 20200828
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/67 ; B65G47/90 ; H01L21/687

Abstract:
A substrate processing apparatus includes an indexer block and a processing block adjacent to the indexer block in a lateral direction of the indexer block. A plurality of processing block layers are stacked in an up-down direction in the processing block. The indexer block includes a container holding portion and a first transfer robot that transfers a substrate between the substrate container held by the container holding portion and the processing block. Each of the processing block layers includes a plurality of processing units, a substrate placing portion, a dummy-substrate housing portion, and a second transfer robot that transfers a substrate between the substrate placing portion and the plurality of processing units and that transfers a dummy substrate between the dummy-substrate housing portion and the plurality of processing units.
Public/Granted literature
- US20220068682A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2022-03-03
Information query
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