Invention Grant
- Patent Title: Ground electrode formed in an electrostatic chuck for a plasma processing chamber
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Application No.: US16600997Application Date: 2019-10-14
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Publication No.: US11640917B2Publication Date: 2023-05-02
- Inventor: Michael R. Rice , Vijay D. Parkhe
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01T23/00 ; H01L21/67 ; H01J37/32
Abstract:
Disclosed herein is a substrate support assembly having a ground electrode mesh disposed therein along a side surface of the substrate support assembly. The substrate support assembly has a body. The body has an outer top surface, an outer side surface and an outer bottom surface enclosing an interior of the body. The body has a ground electrode mesh disposed in the interior of the body and adjacent the outer side surface, wherein the ground electrode does not extend through to the outer top surface or the outer side surface.
Public/Granted literature
- US20200185249A1 GROUND ELECTRODE FORMED IN AN ELECTROSTATIC CHUCK FOR A PLASMA PROCESSING CHAMBER Public/Granted day:2020-06-11
Information query
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