- Patent Title: Horizontal programmable conducting bridges between conductive lines
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Application No.: US17336420Application Date: 2021-06-02
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Publication No.: US11640937B2Publication Date: 2023-05-02
- Inventor: H. Jim Fulford , Mark I. Gardner , Anton J. deVilliers
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L23/525
- IPC: H01L23/525 ; H01L45/00

Abstract:
In a method for forming a semiconductor device, a plurality of conductive lines is formed as a part of a first wiring level of the semiconductor device. The first wiring level is positioned over a first level having a plurality of transistor devices. The plurality of conductive lines extends parallel to the first level. In addition, a programmable horizontal bridge is formed that extends parallel to the first level, and electrically connects a first conductive line and a second conductive line of the plurality of conductive lines in the first wiring level. The programmable horizontal bridge is formed based on a programmable material that changes phase between a conductive state and a non-conductive state according to a current pattern delivered to the programmable horizontal bridge.
Public/Granted literature
- US20210287980A1 HORIZONTAL PROGRAMMABLE CONDUCTING BRIDGES BETWEEN CONDUCTIVE LINES Public/Granted day:2021-09-16
Information query
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