Invention Grant
- Patent Title: Light emitting module
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Application No.: US17116531Application Date: 2020-12-09
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Publication No.: US11640957B2Publication Date: 2023-05-02
- Inventor: So Sakamaki , Yasunori Nagahama , Masahiko Sano , Katsuyoshi Kadan
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Global IP Counselors, LLP
- Priority: JPJP2018-123939 20180629
- Main IPC: H01L25/075
- IPC: H01L25/075 ; H01L33/50 ; H01L33/62 ; H01L33/60 ; H01L33/00

Abstract:
A light emitting module includes a substrate, a light reflective resin layer, wiring electrodes and a light emitting element. The light reflective resin layer is arranged on the substrate. The wiring electrodes are arranged over the substrate with the light reflective resin layer being interposed between the substrate and the wiring electrodes. The light emitting element has an electrode formation surface including a positive and negative pair of element electrodes, and a light emitting surface on a side opposite to the electrode formation surface. The light emitting element is arranged on top surfaces of the wiring electrodes with the element electrodes facing the top surfaces of the wiring electrodes.
Public/Granted literature
- US20210091053A1 LIGHT EMITTING MODULE Public/Granted day:2021-03-25
Information query
IPC分类: