- Patent Title: Photosensitive assembly, method for manufacturing same, and electronic device comprising a vibration member to vibrate an orthographic projection region of a light sensor on a light transmissive substrate in an undulated shape
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Application No.: US17665802Application Date: 2022-02-07
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Publication No.: US11640966B2Publication Date: 2023-05-02
- Inventor: Xiaotong Liu , Yuju Chen
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: IPro, PLLC
- Priority: CN202110235406.8 20210303
- Main IPC: H01L27/146
- IPC: H01L27/146 ; G06V40/13
Abstract:
Disclosed are a photosensitive assembly, a method for manufacturing the same, and an electronic device. The photosensitive assembly includes a light-transmissive substrate, a light sensor, and a vibration member. The light sensor is disposed on a side of the light-transmissive substrate, and the vibration member is configured to drive the light-transmissive substrate to vibrate, such that a photosensitive area of the light-transmissive substrate is in an undulated shape.
Public/Granted literature
- US20220285417A1 PHOTOSENSITIVE ASSEMBLY, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEVICE Public/Granted day:2022-09-08
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