Invention Grant
- Patent Title: Non-conformal oxide liner and manufacturing methods thereof
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Application No.: US17026976Application Date: 2020-09-21
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Publication No.: US11640977B2Publication Date: 2023-05-02
- Inventor: Ming-Ho Lin , Chun-Heng Chen , Xiong-Fei Yu , Chi On Chui
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L29/417 ; H01L21/8234 ; H01L29/78 ; H01L29/66

Abstract:
A method includes forming a fin protruding over a substrate; forming a conformal oxide layer over an upper surface and along sidewalls of the fin; performing an anisotropic oxide deposition or an anisotropic plasma treatment to form a non-conformal oxide layer over the upper surface and along the sidewalls of the fin; and forming a gate electrode over the fin, the conformal oxide layer and the non-conformal oxide layer being between the fin and the gate electrode.
Public/Granted literature
- US20210005727A1 Non-Conformal Oxide Liner and Manufacturing Methods Thereof Public/Granted day:2021-01-07
Information query
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