Invention Grant
- Patent Title: Semiconductor device and method
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Application No.: US17212367Application Date: 2021-03-25
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Publication No.: US11640983B2Publication Date: 2023-05-02
- Inventor: Shahaji B. More , Chandrashekhar Prakash Savant
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/10 ; H01L29/66

Abstract:
In an embodiment, a device includes: a gate dielectric over a substrate; a gate electrode over the gate dielectric, the gate electrode including: a work function tuning layer over the gate dielectric; a glue layer over the work function tuning layer; a fill layer over the glue layer; and a void defined by inner surfaces of at least one of the fill layer, the glue layer, and the work function tuning layer, a material of the gate electrode at the inner surfaces including a work function tuning element.
Information query
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