The present disclosure relates to a semiconductor package device including a stacked antenna structure with a high-k laminated dielectric layer separating antenna and ground planes, and a method of manufacturing the structure. A semiconductor die is laterally encapsulated within an insulating structure comprising a first redistributions structure. A second redistribution structure is disposed over and electrically coupled to the first redistribution structure and the die. The second redistribution structure includes the stacked antenna structure which includes first and second conductive planes separated by a high dielectric constant laminated dielectric structure. The first conductive plane includes openings and the second conductive plane is configured to transmit and receive electromagnetic waves through the openings in the first conductive plane.