Ear-fitting headphone attachment apparatus, systems that utilize the aforementioned attachment apparatus, and methods of its manufacture and use. In one aspect, an attachment apparatus is disclosed. In one embodiment, the attachment apparatus includes a coiled wire having an interference dimension. The coiled wire includes an attachment point for the attachment of a decorative item. In another embodiment, the attachment apparatus includes an extruded or injection molded tube of material. A pair of wires wraps around the tube of material in opposite direction, the pair of wires residing around an outside perimeter of the tube of material and entering into the tube of material where it exits at a bottom portion of the tube of material. In yet another embodiment, the attachment apparatus includes a woven textile having a crosshatch pattern associated therewith. In yet another embodiment, the attachment apparatus includes thin metal strips that collectively have a crosshatch pattern associated therewith.