Method for manufacturing printed circuit board
Abstract:
A method for manufacturing a printed circuit board according to one embodiment of the present invention includes a step of forming a resist pattern, and a step of forming a conductive pattern by using the resist pattern. The resist pattern has an acute angle portion in which an outer edge of a resist is bent to form an acute angle in a plan view. In a corner portion of the acute angle portion, an outer-side outer edge of the resist is rounded, and a radius of curvature of the outer-side outer edge is more than or equal to a distance from the outer-side outer edge to another outer edge adjacent thereto in a direction away from a center of curvature of the outer-side outer edge.
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