Invention Grant
- Patent Title: Method for manufacturing printed circuit board
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Application No.: US16474705Application Date: 2017-12-04
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Publication No.: US11641716B2Publication Date: 2023-05-02
- Inventor: Kou Noguchi , Hiroshi Ueda
- Applicant: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Applicant Address: JP Koka
- Assignee: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Current Assignee: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Current Assignee Address: JP Koka
- Agency: Faegre Drinker Biddle & Reath LLP
- Priority: JPJP2017-000617 20170105
- International Application: PCT/JP2017/043443 WO 20171204
- International Announcement: WO2018/128037 WO 20180712
- Main IPC: H05K3/07
- IPC: H05K3/07 ; H05K3/00 ; G03F7/09 ; H05K3/06 ; H05K3/18

Abstract:
A method for manufacturing a printed circuit board according to one embodiment of the present invention includes a step of forming a resist pattern, and a step of forming a conductive pattern by using the resist pattern. The resist pattern has an acute angle portion in which an outer edge of a resist is bent to form an acute angle in a plan view. In a corner portion of the acute angle portion, an outer-side outer edge of the resist is rounded, and a radius of curvature of the outer-side outer edge is more than or equal to a distance from the outer-side outer edge to another outer edge adjacent thereto in a direction away from a center of curvature of the outer-side outer edge.
Public/Granted literature
- US20210136921A1 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD Public/Granted day:2021-05-06
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