Invention Grant
- Patent Title: Electromagnetic compatibility contact between metal castings and printed circuit boards
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Application No.: US17463832Application Date: 2021-09-01
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Publication No.: US11641718B2Publication Date: 2023-05-02
- Inventor: Jianing Chen , Jon Curry , David Jia
- Applicant: Harman International Industries, Incorporated
- Applicant Address: US CT Stamford
- Assignee: Harman International Industries, Incorporated
- Current Assignee: Harman International Industries, Incorporated
- Current Assignee Address: US CT Stamford
- Agent Angela Brunetti
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K5/04 ; H05K5/06 ; H05K3/34 ; H05K5/00
Abstract:
An electronic device having at least one circuit board. The circuit board has a predetermined pattern of solder bumps facilitating a ground connection with a first enclosure member and/or a second enclosure member. The at least one circuit board is sandwiched between the first and second enclosure members, each of the first and second enclosure members has a surface facing the circuit board and the surface facing the circuit board has a bead extending therefrom contacting the predetermined pattern of solder bumps to complete the ground connection.
Public/Granted literature
- US20230067621A1 ELECTROMAGNETIC COMPATIBILITY CONTACT BETWEEN METAL CASTINGS AND PRINTED CIRCUIT BOARDS Public/Granted day:2023-03-02
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