Invention Grant
- Patent Title: Manufacturing method of printed circuit board
-
Application No.: US16953331Application Date: 2020-11-20
-
Publication No.: US11641719B2Publication Date: 2023-05-02
- Inventor: Hegen Zhang , Xianyou Deng , Jinfeng Liu , Fuyu Xiang , Bo Wang , Zhicheng Yang
- Applicant: SHENNAN CIRCUITS CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: SHENNAN CIRCUITS CO., LTD.
- Current Assignee: SHENNAN CIRCUITS CO., LTD.
- Current Assignee Address: CN Shenzhen
- Priority: CN201911422825.1 20191231
- Main IPC: H05K3/46
- IPC: H05K3/46 ; B32B38/10 ; H05K3/44

Abstract:
The present disclosure provides a printed circuit board and a manufacturing method of the printed circuit board. The manufacturing method may include: at least two core plates may be provided; a composite anti-glue film assembly may be arranged at a preset position of one of the at least two core plates, the composite anti-glue film assembly may include a first anti-glue film layer, a second anti-glue film layer and a bonding layer. The first anti-glue film layer may contact the preset position. The first anti-glue film layer may be a polyimide layer. The bonding layer may be configured to bond the first anti-glue film layer and the second anti-glue film layer together to produce the composite anti-glue film assembly. Two adjacent core plates may be connected through a medium layer. The core plates may be cut-out and form the printed circuit board.
Public/Granted literature
- US20210204413A1 MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD Public/Granted day:2021-07-01
Information query