A method for manufacturing a SRAM cell includes forming a first p-well in a semiconductor substrate; forming a first semiconductor fin extending within the first p-well; forming a first mask layer over the first semiconductor fin; patterning the first mask layer to expose a first channel region of the first semiconductor fin, while leaving a second channel region of the first semiconductor fin covered by the first mask layer; with the patterned first mask layer in place, doping the first channel region of the first semiconductor fin with a first dopant; after doping the first channel region of the first semiconductor fin, removing the first mask layer from the second channel region; and forming a first gate structure extending across the first channel region of the first semiconductor fin and a second gate structure extending across the second channel region of the first semiconductor fin.