Invention Grant
- Patent Title: Memory arrays and methods used in forming a memory array comprising strings of memory cells
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Application No.: US17468170Application Date: 2021-09-07
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Publication No.: US11641742B2Publication Date: 2023-05-02
- Inventor: Cole Smith , Ramey M. Abdelrahaman , Silvia Borsari , Chris M. Carlson , David Daycock , Matthew J. King , Jin Lu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; G11C5/06 ; H01L27/11556 ; H01L27/1157 ; H01L23/522 ; H01L27/11524 ; H01L27/11565 ; H01L27/11519

Abstract:
A method used in forming a memory array comprising strings of memory cells comprises forming a stack comprising vertically-alternating first tiers and second tiers. Horizontally-elongated trenches are formed into the stack to form laterally-spaced memory-block regions. A wall is formed in individual of the trenches laterally-between immediately-laterally-adjacent of the memory-block regions. The forming of the wall comprises lining sides of the trenches with insulative material comprising at least one of an insulative nitride and elemental-form boron. A core material is formed in the trenches to span laterally-between the at least one of the insulative nitride and the elemental-form boron. Structure independent of method is disclosed.
Public/Granted literature
- US20210408039A1 Memory Arrays and Methods Used in Forming a Memory Array Comprising Strings of Memory Cells Public/Granted day:2021-12-30
Information query
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