Invention Grant
- Patent Title: Image pickup element, stacked image pickup element, and solid image pickup apparatus
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Application No.: US17257740Application Date: 2019-07-03
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Publication No.: US11641750B2Publication Date: 2023-05-02
- Inventor: Masahiro Joei , Kenichi Murata , Shintarou Hirata , Toshihiko Hayashi
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: JPJP2018-134012 20180717,JPJP2019-123550 20190702
- International Application: PCT/JP2019/026474 WO 20190703
- International Announcement: WO2020/017330 WO 20200123
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L27/28 ; H01L27/30 ; H01L51/42
Abstract:
An image pickup element includes a photoelectric conversion section including a first electrode, a photoelectric conversion layer including an organic material, and a second electrode stacked on one another. Between the first electrode and the photoelectric conversion layer, an oxide semiconductor layer and an oxide film are formed from the first electrode side.
Public/Granted literature
- US20210288111A1 IMAGE PICKUP ELEMENT, STACKED IMAGE PICKUP ELEMENT, AND SOLID IMAGE PICKUP APPARATUS Public/Granted day:2021-09-16
Information query
IPC分类:
