Invention Grant
- Patent Title: Bond pattern
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Application No.: US16357685Application Date: 2019-03-19
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Publication No.: US11642255B2Publication Date: 2023-05-09
- Inventor: Ray Dennis Dria , Michael Joseph Page , Joseph Leslie Grolmes , Scott Alan King , Matthew Steven Ritter , Christopher Colin Arp
- Applicant: The Procter & Gamble Company
- Applicant Address: US OH Cincinnati
- Assignee: THE PROCTER & GAMBLE COMPANY
- Current Assignee: THE PROCTER & GAMBLE COMPANY
- Current Assignee Address: US OH Cincinnati
- Agent Sarah M. DeCristofaro; Wednesday G. Shipp
- Main IPC: A61F13/515
- IPC: A61F13/515 ; A61F13/511 ; A61F13/514 ; A61F13/15 ; A61F13/51 ; A61F13/551 ; A61F13/53

Abstract:
A composite includes a first substrate and a second substrate joined in a bonding region, wherein the first substrate comprises a first Peak Force Tensile Strength and the second Peak Force Tensile Strength. The first Peak Force Tensile Strength is greater than or equal to the second Peak Force Tensile Strength. The bonding region has a Bond Density of about 10% to about 22%; and a Composite Tensile Strength at Peak Force that is within about 15% of the second Peak Force Tensile Strength.
Public/Granted literature
- US20190290504A1 BOND PATTERN Public/Granted day:2019-09-26
Information query
IPC分类: