Invention Grant
- Patent Title: Discontinuous conductive filler polymer-matrix composites for electromagnetic shielding
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Application No.: US16537245Application Date: 2019-08-09
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Publication No.: US11642519B2Publication Date: 2023-05-09
- Inventor: Bernard Li , Chad Cai , Xingfu Chen
- Applicant: MEDTRONIC, INC.
- Applicant Address: US MN Minneapolis
- Assignee: MEDTRONIC, INC.
- Current Assignee: MEDTRONIC, INC.
- Current Assignee Address: US MN Minneapolis
- Agency: Withers & Keys, LLC
- The original application number of the division: US14717881 2015.05.20
- Main IPC: A61N1/08
- IPC: A61N1/08 ; A61N1/05

Abstract:
A medical electrical lead having a conductor assembly covered by an insulating layer, and a shield covering positioned adjacent or proximate to at least a portion of the insulating layer in order to shield the conductor assembly from one or more electromagnetic fields. The shield covering is formed of a polymer-matrix composite. The polymer-matrix composite includes a polymeric resin having discontinuous conductive fillers provided therein. The discontinuous conductive fillers include one or more of nano-sized metal structures and nano-sized non-metallic conductive structures. The nano-sized non-metallic conductive structures can have a coating formed of one or more metals. The nano-sized non-metallic conductive structures can be formed of carbon. In turn, the nano-sized non-metallic conductive structures can include one or more of carbon nanofibers, carbon filaments, carbon nanotubes, and carbon nanoflakes.
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