Invention Grant
- Patent Title: Cutting tool
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Application No.: US16096310Application Date: 2017-04-21
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Publication No.: US11642730B2Publication Date: 2023-05-09
- Inventor: Masahiro Waki
- Applicant: KYOCERA CORPORATION
- Applicant Address: JP Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto
- Agency: Viering, Jentschura & Partner mbB
- Priority: JP 2016087151 2016.04.25
- International Application: PCT/JP2017/016057 2017.04.21
- International Announcement: WO2017/188154A 2017.11.02
- Date entered country: 2018-10-25
- Main IPC: B23C5/16
- IPC: B23C5/16 ; B23B27/14 ; B23D77/00

Abstract:
A cutting tool may include a base member and a diamond layer located on the base member. The cutting tool may include a first surface, a second surface, and a cutting edge located in at least a part of a ridge line which the first surface intersects with the second surface. The diamond layer may be located in at least a part of the first surface, at least a part of the second surface, and at least a part of the cutting edge. A maximum height in the cutting edge may be smaller than a maximum height in the first surface. The maximum height in the cutting edge may be greater than a maximum height in the second surface.
Public/Granted literature
- US20190134721A1 CUTTING TOOL Public/Granted day:2019-05-09
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