Invention Grant
- Patent Title: Laser pipe cutting device
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Application No.: US17863423Application Date: 2022-07-13
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Publication No.: US11642742B2Publication Date: 2023-05-09
- Inventor: Yang Liu
- Applicant: HSG LASER CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: HSG LASER CO., LTD.
- Current Assignee: HSG LASER CO., LTD.
- Current Assignee Address: CN Foshan
- Priority: CN 2110887123.1 2021.08.03
- Main IPC: B23K26/38
- IPC: B23K26/38 ; B23K101/06

Abstract:
A laser pipe cutting device is provided. It includes a cutting head, a lathe bed, a first chuck, a second chuck and a third chuck; the first chuck is a fixed chuck for positioning axially and radially a pipe fitting; the second chuck is a rolling chuck for positioning radially the pipe fitting; and a fixed clamping disc and a rolling clamping disc are arranged on the third chuck at both ends. In the scheme, the third chuck integrates both the rolling clamping function and the fixed clamping function to achieve larger supporting weight and more accurate clamping precision, so that the chucks can drive a thin pipe fitting to rotate at a higher speed, the cutting efficiency is improved, and no-dead-angle and zero-tailing cutting is achieved.
Public/Granted literature
- US20230040145A1 LASER PIPE CUTTING DEVICE Public/Granted day:2023-02-09
Information query
IPC分类: