Invention Grant
- Patent Title: Three-dimensional printing
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Application No.: US17051941Application Date: 2019-01-18
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Publication No.: US11642843B2Publication Date: 2023-05-09
- Inventor: Tienteh Chen , Allen Jin , Kenneth Flack
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2019/014102 2019.01.18
- International Announcement: WO2020/149848A 2020.07.23
- Date entered country: 2020-10-30
- Main IPC: B29C64/165
- IPC: B29C64/165 ; B33Y10/00 ; B33Y70/00 ; C08G18/32 ; B29C64/194 ; C08G18/10 ; B29K75/00 ; B29K105/00

Abstract:
A materials kit for three-dimensional (3D) printing can include a powder bed material comprising thermoplastic polyurethane particles and a fusing agent including a radiation absorber to selectively apply to the powder bed material. The thermoplastic polyurethane particles can have an average particle size from about 20 μm to about 120 μm and a melting temperature of from about 100° C. to about 250° C., wherein the thermoplastic polyurethane particles include polyurethane polymer strands having an average of about 10 wt % to about 30 wt % hard segments based on a total weight of the thermoplastic polyurethane particles. The hard segments can include a symmetrical aliphatic diisocyanate and a symmetrical aliphatic chain extender that are polymerized into the thermoplastic polyurethane particles.
Public/Granted literature
- US20210331385A1 THREE-DIMENSIONAL PRINTING Public/Granted day:2021-10-28
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