Invention Grant
- Patent Title: Three-dimensional printing with adhesion promoters
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Application No.: US17417069Application Date: 2019-08-06
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Publication No.: US11642844B2Publication Date: 2023-05-09
- Inventor: Tienteh Chen , Shannon Reuben Woodruff
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2019/045292 2019.08.06
- International Announcement: WO2021/025686A 2021.02.11
- Date entered country: 2021-06-21
- Main IPC: B29C64/165
- IPC: B29C64/165 ; B33Y10/00 ; B33Y70/10 ; B29C64/188 ; B29C64/295 ; B33Y30/00 ; B33Y40/20

Abstract:
The present disclosure describes multi-fluid kits for three-dimensional printing, three-dimensional printing kits, and methods of three-dimensional printing. In one example, a multi-fluid kit for three-dimensional printing can include a binder agent and an adhesion promoter agent. The binder agent can include water and latex particles in an amount from about 5 wt % to about 30 wt % based on the total weight of the binder agent. The adhesion promoter can include water and an adhesion promoter that includes catechol or a non-polymeric catechol derivative.
Public/Granted literature
- US20220168951A1 THREE-DIMENSIONAL PRINTING WITH ADHESION PROMOTERS Public/Granted day:2022-06-02
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