Invention Grant
- Patent Title: 3D build platform refill opening and cap
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Application No.: US17680661Application Date: 2022-02-25
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Publication No.: US11642847B2Publication Date: 2023-05-09
- Inventor: Marius Valles , Pau Martin Vidal , Rafel Texido , Joan Mach
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Shook, Hardy & Bacon L.L.P.
- Main IPC: B29C64/245
- IPC: B29C64/245 ; B33Y30/00 ; B33Y40/00 ; B29C64/321
Abstract:
In example implementations, an apparatus includes a build platform and a cap. The build platform has an opening on a top surface to fill a build material storage unit. The cap is inserted into the opening to seal the opening. A top surface of the cap and the top surface of the build platform have a uniform thermal conductivity when the cap is inserted into the opening.
Public/Granted literature
- US20220176629A1 3D BUILD PLATFORM REFILL OPENING AND CAP Public/Granted day:2022-06-09
Information query
