Invention Grant
- Patent Title: Die for a printhead
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Application No.: US16766525Application Date: 2019-02-06
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Publication No.: US11642884B2Publication Date: 2023-05-09
- Inventor: Michael W. Cumbie , Scott A. Linn , Anthony M. Fuller , James Michael Gardner
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Foley & Lardner LLP
- International Application: PCT/US2019/016782 2019.02.06
- International Announcement: WO2020/162911A 2020.08.13
- Date entered country: 2020-05-22
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die, wherein the fluid feed holes are formed through a substrate of the die. The die includes a number of fluidic actuators, proximate to the fluid feed holes, to eject fluid received from the fluid feed holes. Circuitry on the die operates the fluidic actuators, wherein traces are provided in layers between adjacent fluid feed holes, connecting circuitry on each side of the fluid feed holes.
Public/Granted literature
- US20210354462A1 DIE FOR A PRINTHEAD Public/Granted day:2021-11-18
Information query
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