Invention Grant
- Patent Title: Ejection head having optimized fluid ejection characteristics
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Application No.: US17237312Application Date: 2021-04-22
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Publication No.: US11642887B2Publication Date: 2023-05-09
- Inventor: Michael A. Marra, III
- Applicant: Funai Electric Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Funai Electric Co., Ltd.
- Current Assignee: Funai Electric Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Luedeka Neely Group, Inc.
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
An ejection head. The ejection head includes first fluid ejectors and second fluid ejectors deposited on a semiconductor substrate. A first flow feature layer is attached to the semiconductor substrate to provide a first fluid supply channels and a first fluid chambers and a first portion of second fluid channel and second fluid chambers therein. A second flow feature layer is attached to the first flow feature layer to provide a first portion of first nozzle holes and a second portion of second fluid supply channels and second fluid chambers therein. A first nozzle plate layer is attached to the second flow feature layer to provide a second portion of the first nozzle holes and a first portion of second nozzle holes therein. A second nozzle plate layer is attached to the first nozzle plate layer to provide a second portion of the second nozzle holes therein.
Public/Granted literature
- US20220339933A1 EJECTION HEAD HAVING OPTIMIZED FLUID EJECTION CHARACTERISTICS Public/Granted day:2022-10-27
Information query
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