Invention Grant
- Patent Title: Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
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Application No.: US17784281Application Date: 2020-12-09
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Publication No.: US11643493B2Publication Date: 2023-05-09
- Inventor: Yune Kumazawa , Takuya Suzuki , Seiji Shika , Shunsuke Katagiri
- Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP 2019223947 2019.12.11
- International Application: PCT/JP2020/045841 2020.12.09
- International Announcement: WO2021/117762A 2021.06.17
- Date entered country: 2022-06-10
- Main IPC: C08G73/10
- IPC: C08G73/10 ; C08F234/00 ; C08K5/092 ; H05K1/03

Abstract:
Provided is a resin composition which has good solubility and photocurability, further has good alkaline-developability when containing a photo initiator and a compound containing one or more carboxyl groups, and in addition, is capable of providing a resin sheet having suppressed tackiness; and a resin sheet, multilayer printed wiring board, and semiconductor device using the same. The resin composition of the present invention contains a particular bismaleimide compound (A), and at least two maleimide compounds (B) selected from the group consisting of six kinds of particular compounds which are different from this bismaleimide compound (A).
Public/Granted literature
- US20230066153A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE Public/Granted day:2023-03-02
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