Invention Grant
- Patent Title: Mounting system for architectural panels
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Application No.: US17210355Application Date: 2021-03-23
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Publication No.: US11643821B2Publication Date: 2023-05-09
- Inventor: Philip Andrew Vernon
- Applicant: EVERGROW INTERNATIONAL TRADING (SHANGHAI) CO., LTD.
- Applicant Address: CN Shanghai
- Assignee: DIGITAL ENVIRONMENT CONSTRUCTION, LLC
- Current Assignee: DIGITAL ENVIRONMENT CONSTRUCTION, LLC
- Current Assignee Address: US CO Colorado Springs
- Agency: Hovey Williams LLP
- Main IPC: E04F13/08
- IPC: E04F13/08 ; E04F13/14

Abstract:
The invention concerns a mounting system to support free-form architectural panels, in particular molded panels made from fiber composite materials such as concrete, resin, and gypsum. The mounting system comprises a socket which can be securely embedded in the panel during casting. The mounting system further comprises a ball joint which is clamped into the socket and allows for attachment of the panel to support structure.
Public/Granted literature
- US20210293031A1 MOUNTING SYSTEM FOR ARCHITECTURAL PANELS Public/Granted day:2021-09-23
Information query
IPC分类: