Invention Grant
- Patent Title: Cryopump
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Application No.: US16533097Application Date: 2019-08-06
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Publication No.: US11644024B2Publication Date: 2023-05-09
- Inventor: Kakeru Takahashi
- Applicant: SUMITOMO HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
- Current Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Michael Best & Friedrich LLP
- Priority: JP 2017020601 2017.02.07
- Main IPC: F04B37/02
- IPC: F04B37/02 ; F04B39/06 ; F25D19/00 ; F04B37/08

Abstract:
A cryopump includes a cryocooler which includes a high-temperature cooling stage and a low-temperature cooling stage, a radiation shield which is thermally coupled to the high-temperature cooling stage and axially extends in a tubular shape from a cryopump intake port, and a low-temperature cryopanel section which is thermally coupled to the low-temperature cooling stage, is surrounded by the radiation shield, and includes a plurality of cryopanels and a plurality of heat transfer bodies axially arranged in columnar shape, and in which the plurality of cryopanels and the plurality of heat transfer bodies are axially stacked.
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