Invention Grant
- Patent Title: Thermal transfer device having a fluid conduit
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Application No.: US17176454Application Date: 2021-02-16
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Publication No.: US11644254B2Publication Date: 2023-05-09
- Inventor: Henri Klaba , Ali Chehade , Hadrien Bauduin , Angelos Lyris
- Applicant: OVH
- Applicant Address: FR Roubaix
- Assignee: OVH
- Current Assignee: OVH
- Current Assignee Address: FR Roubaix
- Agency: BCF LLP
- Priority: EP 315027 2018.09.04
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F13/12 ; F28F13/06 ; F28F13/08
Abstract:
A thermal transfer device has a body and a fluid conduit defined in the body. The body has a thermal transfer surface configured to be placed in contact with a target component. The fluid conduit is configured for conveying fluid through the body and is thermally coupled to the thermal transfer surface.
Public/Granted literature
- US20210164738A1 THERMAL TRANSFER DEVICE HAVING A FLUID CONDUIT Public/Granted day:2021-06-03
Information query
