• Patent Title: Temperature sensor and device including temperature sensor
  • Application No.: US16758393
    Application Date: 2018-10-15
  • Publication No.: US11644368B2
    Publication Date: 2023-05-09
  • Inventor: Mitsutoshi Ogura
  • Applicant: SEMITEC Corporation
  • Applicant Address: JP Tokyo
  • Assignee: SEMITEC Corporation
  • Current Assignee: SEMITEC Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: JCIPRNET
  • Priority: JP 2017209090 2017.10.30
  • International Application: PCT/JP2018/038303 2018.10.15
  • International Announcement: WO2019/087755A 2019.05.09
  • Date entered country: 2020-04-22
  • Main IPC: G01K7/22
  • IPC: G01K7/22
Temperature sensor and device including temperature sensor
Abstract:
A temperature sensor and a device are provided, in which the temperature sensor is capable of reducing thickness, increasing a contact area with an object whose temperature is to be measured, and improving measurement accuracy. A temperature sensor is provided with: a thermistor element; a lead-out wire connected to the thermistor element; a lead wire connected to the lead-out wire; an inner layer formed by heating and curing or by melting and solidifying a pair of sheet-like inner layer materials formed of a resin material; and outer layers formed of a pair of sheet-like outer layer materials formed of a resin material and having flat surfaces on both sides. The thermistor element, the lead-out wire, and a connection part between the lead-out wire and the lead wire are covered with the inner layer, and are also covered with the pair of outer layers by being sandwiched therebetween.
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