Invention Grant
- Patent Title: Temperature sensor and device including temperature sensor
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Application No.: US16758393Application Date: 2018-10-15
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Publication No.: US11644368B2Publication Date: 2023-05-09
- Inventor: Mitsutoshi Ogura
- Applicant: SEMITEC Corporation
- Applicant Address: JP Tokyo
- Assignee: SEMITEC Corporation
- Current Assignee: SEMITEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JP 2017209090 2017.10.30
- International Application: PCT/JP2018/038303 2018.10.15
- International Announcement: WO2019/087755A 2019.05.09
- Date entered country: 2020-04-22
- Main IPC: G01K7/22
- IPC: G01K7/22

Abstract:
A temperature sensor and a device are provided, in which the temperature sensor is capable of reducing thickness, increasing a contact area with an object whose temperature is to be measured, and improving measurement accuracy. A temperature sensor is provided with: a thermistor element; a lead-out wire connected to the thermistor element; a lead wire connected to the lead-out wire; an inner layer formed by heating and curing or by melting and solidifying a pair of sheet-like inner layer materials formed of a resin material; and outer layers formed of a pair of sheet-like outer layer materials formed of a resin material and having flat surfaces on both sides. The thermistor element, the lead-out wire, and a connection part between the lead-out wire and the lead wire are covered with the inner layer, and are also covered with the pair of outer layers by being sandwiched therebetween.
Public/Granted literature
- US20200249097A1 TEMPERATURE SENSOR AND DEVICE INCLUDING TEMPERATURE SENSOR Public/Granted day:2020-08-06
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