Invention Grant
- Patent Title: Reallocation of power between electronic components
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Application No.: US17416075Application Date: 2019-07-31
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Publication No.: US11644881B2Publication Date: 2023-05-09
- Inventor: Chao Wen Cheng , Po Ying Chih , Yen Tang Chang
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: Knobbe, Martens, Olson & Bear, LLP
- International Application: PCT/US2019/044559 2019.07.31
- International Announcement: WO2021/021205A 2021.02.04
- Date entered country: 2021-06-18
- Main IPC: G06F1/26
- IPC: G06F1/26 ; G06F1/3206 ; G06F1/3215 ; G06F1/3234 ; G06F9/50

Abstract:
Techniques for reallocating power between a plurality of electronic components and a connection port of a computing system are described. In operation, operational state of an electronic component from amongst multiple electronic components is analysed. Based on the operational state of the electronic component, an unused power available with the electronic components is determined. Based on the availability of the unused power, a default power level associated with the connection port is increased, where the default power level is a predefined power allocated to the connection port for operation.
Public/Granted literature
- US20220147129A1 REALLOCATION OF POWER BETWEEN ELECTRONIC COMPONENTS Public/Granted day:2022-05-12
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