Invention Grant
- Patent Title: Error detection within an integrated circuit chip
-
Application No.: US16528394Application Date: 2019-07-31
-
Publication No.: US11645143B2Publication Date: 2023-05-09
- Inventor: Gajinder Panesar
- Applicant: SIEMENS INDUSTRY SOFTWARE INC.
- Applicant Address: US TX Plano
- Assignee: Siemens Industry Software Inc.
- Current Assignee: Siemens Industry Software Inc.
- Current Assignee Address: US TX Plano
- Agency: Lempia Summerfield Katz LLC
- Priority: GB 15044 2018.09.14
- Main IPC: G06F11/00
- IPC: G06F11/00 ; G06F11/07 ; G06F13/40

Abstract:
A method of performing error detection within an integrated circuit chip analyses transactions communicated over interconnect circuitry of the integrated circuit chip to detect whether a message contains a data error. A memory of the integrated circuit chip coupled to the interconnect circuitry is scanned to detect whether there is a data error stored in the memory, and in response to detecting a data error in a transaction communicated over the interconnect circuitry and/or a data error stored in the memory, a dedicated action indicative of a data error is performed.
Public/Granted literature
- US20200089562A1 Error Detection Within An Integrated Circuit Chip Public/Granted day:2020-03-19
Information query